More Performance, Reliability and Yield.
Less Aggravation, Time and Program Cost.
… The Best Value Option – IMI
International Micro Industries, headquartered in New Jersey for over 45 years, is the single-source solution for high quality wafer bumping and WLP services – from initial R&D to finished product. IMI caters to a wide range of IC package needs, including electroplated bumps (ECD), 2.5D/3D, CSPs, Copper (Cu) and solder pillar bumps, hi-reliability specifications, fine pitch, void-free and exotic material needs for demanding DOD, medical and aerospace applications. We offer completely scalable production from single unit to high volume. Most importantly, IMI protects your intellectual property securely while getting you to market faster with end-to-end development and production – all in-house.
An hour with IMI can advance your program by months…
Call us to find out how (856-616-0051).
Enabling customers to deliver packaging solutions not attainable with lesser technologies.
Cu Pillar Bump, As Plated Advantage
Advanced High Lead Solder Bump Replacement
Bump/Package Consulting Services
Wafer Sizes and Materials
Custom Bumped Test Chips and Test Wafers
IMI provides scalable wafer bumping and wafer level processing services from prototyping of new designs through high-volume sustained production and turn-key technology licensing agreements for the Medical Implantable, Medical Disposable, Automotive, DOD, Aerospace, Advanced Sensor, Communication and RFID industries.
High Functioning RFID
Ultra High Speed Communications
Always-On Internet of Things
Phased Array Radar
Tell Us About Your Application. Forwarding information about your wafers and your application will enable us to provide you with quick and valuable feedback about our ability to support your program effort.